LIOELM TSU™ 500 series —Low Dk/Df Heat Curable Adhesive Sheets
LIOELM TSU™ 500 series offers low dielectric, heat curable adhesive sheets for flexible multilayer substrates, featuring great transmission loss reduction, which is required for high-frequency circuits (antennas and millimeter-wave radar) supporting fifth-generation communications (5G).
Values of the dielectric constant and dielectric tangent are low, and transmission loss can be reduced significantly compared with conventional interply adhesion sheets. These products also feature superior heat resistance and are designed to be impervious to the high temperatures of lead-free solder reflow.
With excellent adhesive capabilities and heat resistance, these are most suitable for interply adhesive use with multilayer flexible circuit boards. Halogen-free, cadmium-free, and lead-free products.
LIOELM TSU™ 500 series
- Heat curable adhesive sheets that provide the low dielectric constant and low dielectric tangent, featuring heat resistance of solder reflow.
- Halogen-free, environmentally friendly products, UL registered products.
Electronics Materials — Other Product Lineup
LIOELM TSS™ series — EMI Shield FilmsHeat curable shield sheets that achieve both heat resistant and flexible through the special dispersion of conductive filler in the urethane resin of heat-resistant adhesive.
LIOELM TSC™ series — Conductive Adhesive SheetsHeat curable conductive adhesive sheets that ensure constantly high conductivity thanks to the conductive filler dispersed on heat-resistant urethane adhesive resin developed by us.
LIOELM TSU™ 0041SI series — Heat Curable Adhesive SheetsHeat curable adhesive sheets that has heat-resistance to be used for fixing reinforcing plates of FPC and other purposes. They are able to cure rapidly at low temperatures and are designed to endure the high temperatures of lead-free solder reflow.
LIOELM™ LE950 series — Heat Durable and Low Peel FilmsThese are heat-resistant single-sided adhesive tapes that use a low-contamination acrylic adhesive. They are recommended for use as carrier tapes for FPC, electronic components, and the like.
(Adhesive Tapes & Films for Industrial Use)
R310KS-2 — Lead-free Solder Reflow Resistant Adhesive TapeThese are double-sided adhesive tape that use high-performance acrylic adhesive. It is ideal for fixing FPC and other electronic components.
(Adhesive Tapes & Films for Industrial Use)
LIOELM™ FTS series — Thermal Conductive Adhesive SheetsOur original resin and sheet processing technology result in adhesive sheets with excellent insulation property and high heat durability. Also achieved flexibility and softness with high thermal conductivity (maximum 10W/m･K).
LIORESIST™ NSP series — Overcoating Materials for Flexible DisplayThese are insulation coating materials having a very good adhesion onto transparent conductive layers and inorganic layers with bending durability. Enable to protect surface conductive layer or barrier layers of OLED displays.
Inquiries
- Information & Communication material Division
Toyochem Co., Ltd. - TEL : +81-3-3272-0905