Low dk/df heat resistant bonding sheet LIOELM TSU™ 500 Series
LIOELM TSU™ 500 Series has been developed with low dk/df property, adhesive strength, heat resistance and drilling processability which has been regarded as trade-off properties ever. It is ideal as bonding sheet for high speed transmission multi layer FPC. It is halogen-free, cadmium-free, and lead-free.
Product appearance
Application example: Bonding sheet for multi layer FPC
リオエルム TSU® 500シリーズ テクニカルデータシート
Characteristics
Low-dielectric constant/dissipation factor
Specific permittivity (Dk) 2.8 or less
When high-frequency signals flow through the circuit, signal delay is reduced by suppressing the capture of electrons.
Dielectric loss tangent (Df) 0.0020 or less
When high-frequency signals flow through a circuit, transmission loss is reduced by suppressing the electrical energy of the signal from being converted into heat.
Excellent adhesion
Adhesive force to LCP/MPI 10N/cm or more
It has excellent adhesion to both copper foil and high-frequency substrate materials that are difficult to bond with normally.
- LCP:Liquid Crystal Polymer MPI:Modified PI
Heat resistance
Solder heat resistance test 288℃ passed
No bubble or delamination occurs even when the material is exposed to high heat during the soldering process.
Excellent drilling processability
Minimizes scraping during drilling
It is possible to minimize the amount of scraping that occurs during drilling (laser/drill, etc.) to make via holes and through holes in multilayer FPCs.
Inquiries
TOYOCHEM CO., LTD. Information and Communication Materials Sales Division
TEL: +81-3-3272-0905