Fifth-generation (5G) mobile communication systems utilize high frequencies from micro- to millimeter-wave scale bands, making them more susceptible to transmission losses. They require low-loss materials that can reduce signal delay and loss during transmission. Toyochem's low dielectric polymers reduce dielectric loss and stabilize high-frequency communications. They also feature high heat resistance and low elasticity.
- Low dielectric and low dielectric tangent
- Low elasticity
- High heat resistance
Low dielectric polymers developed using Toyochem’s unique know-how have low dielectric properties in the high frequency bands required for 5G communication.
They also demonstrate high adhesion to substrate materials such as copper foil and polyimides, and are highly adaptable as substrate materials.
The unique polymer skeleton design makes our low dielectric polymers low elasticity, soft and ductile. These features allow them be used as a stress relaxation layer. Due to their elasticity, they are also being adapted for emerging wearable applications.
Our low dielectric polymers also maintain solder heat resistance, making them adaptable as substrate materials.
Interlayer insulating layers, solder resists, and other electronic circuit board parts
Low dielectric polymers developed with Toyochem’s proprietary resin design technologies have excellent low dielectric properties, as well as low elasticity and high heat resistance characteristics to help ensure stable high-frequency communication. Additionally, due to their low elasticity, they are capable of achieving stress relaxation throughout entire circuit board substrates. Suited for use in base stations and semiconductor package substrates.
- Information & Communication material Division
Toyochem Co., Ltd.
- TEL : +81-3-3272-0905