low-dielectric Heat Resistant Thermosetting Adhesive Sheet LIOELM TSU™ 500 Series
The LIOELM TSU™ 500 series has been a trade-off in the past, "low-dielectricIt is a thermosetting adhesive sheet that combines ratio/dissipation factor, adhesive strength, heat resistance, and drilling processability. It is ideal for layer-to-layer adhesion applications of multilayer flexible substrates for high-speed transmission. It is halogen-free, cadmium-free, and lead-free.
Product appearance
Application example: interlayer adhesion of multilayer FPC
リオエルム TSU® 500シリーズ テクニカルデータシート
Features
low-dielectric constant/dissipation factor
Specific permittivity (Dk) 2.8 or less
When high-frequency signals flow through the circuit, signal delay is reduced by suppressing the capture of electrons.
Dielectric loss tangent (Df) 0.0020 or less
When high-frequency signals flow through a circuit, transmission loss is reduced by suppressing the electrical energy of the signal from being converted into heat.
Excellent adhesion
Adhesive force to LCP/MPI 10N/cm or more
It has excellent adhesion to high-frequency copper foil and substrate materials that are difficult to bond with normally.
- LCP:Liquid Crystal Polymer MPI:Modified PI
Heat resistance
Solder heat resistance test 288℃ cleared
No foaming or peeling occurs even when high heat is applied during the soldering process.
Excellent drilling processability
Minimizes erosion during drilling
It is possible to minimize the erosion that occurs during drilling (laser/drill, etc.) to form via holes and through holes in multilayer FPCs.
Inquiries
TOYOCHEM CO., LTD. Information and Communication Materials Sales Division
TEL: +81-3-3272-0905