Products & Solutions

low-dielectric Heat Resistant Thermosetting Adhesive Sheet LIOELM TSU™ 500 Series

The LIOELM TSU™ 500 series has been a trade-off in the past, "low-dielectricIt is a thermosetting adhesive sheet that combines ratio/dissipation factor, adhesive strength, heat resistance, and drilling processability. It is ideal for layer-to-layer adhesion applications of multilayer flexible substrates for high-speed transmission. It is halogen-free, cadmium-free, and lead-free.

Product appearance

Product appearance

Application example: interlayer adhesion of multilayer FPC

Application example: interlayer adhesion of multilayer FPC

リオエルム TSU® 500シリーズ テクニカルデータシート

Features

low-dielectric constant/dissipation factor

Specific permittivity (Dk) 2.8 or less

When high-frequency signals flow through the circuit, signal delay is reduced by suppressing the capture of electrons.

Dielectric loss tangent (Df) 0.0020 or less

When high-frequency signals flow through a circuit, transmission loss is reduced by suppressing the electrical energy of the signal from being converted into heat.

Excellent adhesion

Adhesive force to LCP/MPI 10N/cm or more

It has excellent adhesion to high-frequency copper foil and substrate materials that are difficult to bond with normally.

  • LCP:Liquid Crystal Polymer MPI:Modified PI

Heat resistance

Solder heat resistance test 288℃ cleared

No foaming or peeling occurs even when high heat is applied during the soldering process.

Solder heat resistance test

Excellent drilling processability

Minimizes erosion during drilling

It is possible to minimize the erosion that occurs during drilling (laser/drill, etc.) to form via holes and through holes in multilayer FPCs.

Laser processing test

Inquiries

TOYOCHEM CO., LTD. Information and Communication Materials Sales Division

TOYOCHEM CO., LTD.